Henkel To Conduct Sessions at Assembly Technology Expo
Henkel To Conduct Sessions at Assembly Technology Expo
Jason Sandefur
Henkel Corp. applications engineers will deliver three technical presentations at the 2006 Assembly Technology Expo (AT Expo) at Chicago’s Rosemont Convention Center on September 27 from 2-5 p.m. The presentations will be part of the educational tract “Advantages of Adhesive Fasteners to Replace Mechanical Joining Methods,” published by the Adhesives and Sealants Council and Adhesives & Sealants Industry (ASI) magazine.
Brian Noonan will discuss “The Benefits of Volumetric Dispensing of Adhesives,” including advantages of the newest volumetric adhesive dispensing equipment.
Tim Graver will present “Advances in Cyanoacrylate Technology,” an overview of available instant adhesive formulations, as well as a look into the future of cyanoacrylate adhesives and dispense options.
Darryl Small will present “Weld Reduction through Structural Metal Bonding,” a look at replacing welding and mechanical fasteners with structural adhesives for metal-to-metal, metal-to-plastic, and metal-to-composite bonding.
Also at AT Expo, Henkel vice president John Cocco will participate in a keynote panel discussion on “What’s Next in Assembly” at 1 p.m. on September 26.
E-mail: marketing@loctite.com or atexpo.com �2006 FastenerNews.com
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